RELIFE Soldering Paste RL-404 (RELIFE No-clean Solder Paste RL-404)

RELIFE Soldering Paste RL-404 (RELIFE No-clean Solder Paste RL-404)

RELIFE Soldering Paste RL-404 (RELIFE No-clean Solder Paste RL-404) solder paste, solder paste flux, soldering paste 40g 183°C solder paste, 183-degree solder paste, RL404 Relife solder paste. RELIFE No-clean Soldering Paste RL-400 RL-401 RL-404 40g Sn63/Pb67 183°C Solder Paste for iPhone mobile phone BGA Reballing Soldering  RELIFE Solder Paste Flux-1 RL-404 183°C Solder Tin Sn63/Pb67 20-38um, RELIFE Solder Paste, Unique manufacturing of solder past technology, giving a new definition of tin-base technology.

Features/Specs:

• Brand: RELIFE
• Model: RL-404
• Flux Type: Paste 
• Particle size(um): 20-38
• Conductivity (%fCu): 14.0
• Flux content Wt%): 9±05
• Viscosity (25°C Pa.s): 1781±10
• Melting Point: 183℃

Application:

• Great Soldering Rework Tools for SmartPhone
• PCB
• BGA
• Motherboard Repairing

Package Includes:

• 1 X RELIFE Soldering Paste RL-404 (RELIFE No-clean Solder Paste RL-404)

Note: Product Images are shown for illustrative purposes only and may differ from the actual product.