RELIFE Soldering Paste RL-404 (RELIFE No-clean Solder Paste RL-404)
RELIFE Soldering Paste RL-404 (RELIFE No-clean Solder Paste RL-404) solder paste, solder paste flux, soldering paste 40g 183°C solder paste, 183-degree solder paste, RL404 Relife solder paste. RELIFE No-clean Soldering Paste RL-400 RL-401 RL-404 40g Sn63/Pb67 183°C Solder Paste for iPhone mobile phone BGA Reballing Soldering RELIFE Solder Paste Flux-1 RL-404 183°C Solder Tin Sn63/Pb67 20-38um, RELIFE Solder Paste, Unique manufacturing of solder past technology, giving a new definition of tin-base technology.
Features/Specs:
- Brand: RELIFE
- Model: RL-404
- Flux Type: PasteÂ
- Particle size(um): 20-38
- Conductivity (%fCu): 14.0
- Flux content Wt%): 9±05
- Viscosity (25°C Pa.s): 1781±10
- Melting Point: 183℃
Application:
- Great Soldering Rework Tools for SmartPhone
- PCB
- BGA
- Motherboard Repairing
Package Includes:
- 1 X RELIFE Soldering Paste RL-404 (RELIFE No-clean Solder Paste RL-404)
Note: Product Images are shown for illustrative purposes only and may differ from the actual product.
Reviews
There are no reviews yet.